Download e-book for kindle: Adhesives Technology for Electronic Applications: Materials, by James J. Licari,Dale W. Swanson

By James J. Licari,Dale W. Swanson

ISBN-10: 0815515138

ISBN-13: 9780815515135

This booklet is exclusive in its accomplished assurance of all facets of adhesive expertise for microelectronic units and packaging, from conception to bonding to check strategies. as well as common functions, resembling dies, substrate, and lid and chip stack attachments, the ebook contains new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing equipment reminiscent of UV, microwave, and moisture (which agree to present environmental and effort specifications) are lined. Over eighty tables and one hundred twenty figures supply a wealth of knowledge on homes, functionality, and reliability. additionally integrated are examples of commercially on hand adhesives, providers, and gear. each one bankruptcy presents complete references.

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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